Характеристики
- Номер модели
- DS3000-USB3.0-emcp221-002
- Application
- Data recovery cellphone repair program
- Support
- More chips
- Temperature
- -55oC~+175oC
- Connect
- USB3.0
- Data recovery
- Android phone data recovery
- Apply to
- EMCP221 BGA221 EMMC221
- IC size
- 11.5x13mm 12x16mm 12x18mm 14x18mm









