MJ K25 Explosion-Proof Cooling Logic Board Repair Platform for iPhone 11 PCB BGA Reballing Stencil Remove Black Glue

MJ K25 Explosion-Proof Cooling Logic Board Repair Platform for iPhone 11 PCB BGA Reballing Stencil Remove Black Glue

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1 438 руб.

Описание

MJ K25 взрывозащищенный охлаждающий ремонт логической платы платформы для iPhone 11 PCB BGA трафарет удаления черного клея

MJ K25 Explosion-Proof Cooling Logic Board Repair Platform for iPhone 11 PCB BGA Reballing Stencil Remove Black Glue

Характеристики

Brand Name
wozniak
Type
mainboard jig / Motherboard PCB Holder
DIY Supplies
Electrical
Model Number
mj k25
Package
Case
Application
Computer Tool Kit
Size
15*15*6cm
Usag
:Repair tool kit for iPhone11
Function
Repair tools mobile phones