Описание
PHONEFIX 42g 138℃ Sn42/Bi58 Бессвинцовая припойная паста BGA + шприц Плунжер + игольчатая головка для iPhone samsung NAND Flash cpu пайки
Продукт Особенности
Два вида посылка
Технические характеристики изделия
Что в упаковке
Характеристики
- Габаритные размеры
- 42g Soldering Paste Flux
- Материалы для самостоятельного изготовления
- Электрический
- Упаковка
- Сумка
- Номер модели
- Sn42/Bi58
- Бренд
- DIYPHONE
- Применение
- for iPhone repairing
- Тип
- iPhone repair tools
- Item Name
- Low Temperature Lead Free Solder Paste
- Color
- As Pict
- Net Weight
- 42 Picture Shows
- Powder Size
- 25-45um
- Product
- SFD-229
- Function
- for iPhone Motherboard BGA Repair
- Design
- Canned/ Needle Tube
- Features 1
- Lead free, Environmentally Friendly
- Features 2
- Contain Silver, Good Conductivity
- Features 4
- Full Solder Joint, Strong Continuous Printing Performance
- Material
- Unleaded Tin+ Solder Paste
- Number of Pieces
- 1/3/5 PCS
- Ingredient
- Sn42/Bi58
- Granule
- 25-45um
- With Scraper
- Yes
- With Syringe Plunger
- Yes
- Application
- for Phone Hard Disk, CPU IC, etc
- Melting Point
- 138 Degree Celsius
- Usage
- Phone PCB Circuit Board Repair
- Compatible
- for iPhone Samsung Repair
- Length of Syringe Plunger
- 95mm
- With Needle Head
- Yes, for Free
- Advantage
- Lead Free, Contain Silver
- Packing Weight
- 0.1kg
- Drop Shipping
- Support
- Package Including
- Needle Tube/ Bottled Paste, etc
- Suitable for
- Precision Components PCB Welding
- Origin
- ShenZhen, China
- Made in
- China
- Shipping Time
- Within 3 Days
- Is-Customized
- No
Сопутствующие товары
