Характеристики Номер моделиDS3000-USB3.0-emcp221-4516 ApplicationData recovery Restore Retrieve restore SupportMore chips Temperature-55oC~+175oC ConnectUSB3.0 More componentsemmc,LPDDR,DFN,QFN,QFP,BGA,SOP,TSOP Data recoveryAndroid phone data recovery Apply toemcp221 IC size11.5x13mm 12x16mm 12x18mm 14x18mm