Характеристики Номер моделиDS3000-USB3.0-emmc153+169-4597 ApplicationData recovery Restore Retrieve restore SupportMore chips Temperature-55oC~+175oC ConnectUSB3.0 More componentsemmc,LPDDR,DFN,QFN,QFP,BGA,SOP,TSOP Data recoveryAndroid phone data recovery Apply toemmc153 , emmc169 IC size9x11mm 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm